Topics | Keywords |
Emerging Devices, Logic and Memory Technology | FinFET, GAA, and nanosheet based devices; 2D and devices on low-dimensional materials; BEOL compatible transistors; Spintronic and magnetic devices; Novel cryogenic devices; Quantum computing devices; Conventional memories; Emerging memories; 3D memory technologies; Memories for AI and near-memory computing applications; CMOS platform technologies, Advanced, novel process integration schemes and scaling approaches; Sequential, monolithic 3D integration; Memory-Logic 3D stacking |
High Frequency, Power Devices and Circuits, and Compound Semiconductor Technology | Compound semiconductor materials and devices; high-electron mobility transistors (HEMTs); heterojunction bipolar transistors (HBTs); heterostructures; monolithic integration; E/D-mode; epitaxy technology; thermal management; power ICs; power device characterization, modeling, simulation and reliability; high-frequency devices and circuits; MMICs; RFICs; millimeter-wave, sub-THz, and THz integrated circuits; antenna theory, design and measurement; MIMO antennas; beamforming and multi-beam systems. |
Novel Materials and Devices Characterization | Scanning electron microscopy (SEM); Scanning probe microscopy (SPM); Transmission electron microscopy (TEM) with selected area diffraction pattern (SADP); X-ray diffraction (XRD); Auger electron spectrometer (AES); X-ray photoelectron spectroscopy (XPS); Secondary Ion Mass Spectroscopy (SIMS); Fourier-transform infrared spectroscopy (FTIR); Raman spectroscopy; atom probe tomography (APT); Nano-indentation, Spreading resistance profiling (SRP); Hall effect Measurement; Differential Hall Effect Metrology (DHEM); Device reliability; Hot carrier phenomena; Bias temperature instability; Charge trapping; Thermal effect; Flicker noise; RTN; Dielectric breakdown; Failure analysis; Electromigration; Device dynamic characterization; Parameter extraction method |
MEMS, Sensors, Package and Heterogeneous Integration Technology | MEMS devices and systems; Physical and biochemical integrated sensors; Bio-electronic interfaces and implantable devices; Energy harvesting and Flexible devices; Heterogeneous Integration; Wafer-Level Packaging; Fan-Out Packaging; Fan-Out Wafer-Level Packaging(FOWLP); 2.5D/3D Packaging; Silicon Interposer; Through-Silicon Via(TSV); Micro Bump; High-Density Interconnect(HDI); System-in-Package(SiP); Artificial Intelligence(AI); Internet of Things(IoT); High-Performance Computing(HPC); Chiplet; Chip-to-Chip; Chip-to-Wafer; Hybrid Bonding; 3D Stacking; Accelerometer; Gyroscope; Magnetometer; Biosensor; Microfluidics; Microelectromechanical Actuator |
Optoelectronics Devices and Silicon Photonics Technology | Advances in metamaterials, plasmonics, quantum materials and devices; optical design, testing, and engineering; optical information processing and holography; optical trapping; optical sensing; organic photonics; thin film and photovoltaic technology; biophotonics and biomedical imaging; display and solid state lighting; metaverse photonics; energy-conversion devices; silicon photonics; signal and image processing, photonic devices and applications, remote sensing; laser technology |